Center Publications

B. Li and P. D. Franzon, "Machine learning in physical design," 2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS), 2016, pp. 147-150, doi: 10.1109/EPEPS.2016.7835438.

S. J. Park, B. Bae, J. Kim and M. Swaminathan, "Application of Machine Learning for Optimization of 3-D Integrated Circuits and Systems," in IEEE Transactions on Very Large Scale Integration (VLSI) Systems, vol. 25, no. 6, pp. 1856-1865, June 2017, doi: 10.1109/TVLSI.2017.2656843.

H. M. Torun and M. Swaminathan, "Black-box optimization of 3D integrated systems using machine learning," 2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 2017, pp. 1-3, doi: 10.1109/EPEPS.2017.8329698.

H. Yu, M. Swaminathan, C. Ji and D. White, "A method for creating behavioral models of oscillators using augmented neural networks," 2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 2017, pp. 1-3, doi: 10.1109/EPEPS.2017.8329714.

Z. Chen, M. Raginsky and E. Rosenbaum, "Verilog-A compatible recurrent neural network model for transient circuit simulation," 2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 2017, pp. 1-3, doi: 10.1109/EPEPS.2017.8329743.

T. Nguyen, J. E. Schutt-Aine and Y. Chen, "Volterra kernels extraction from frequency-domain data for weakly non-linear circuit time-domain simulation," 2017 IEEE Radio and Antenna Days of the Indian Ocean (RADIO), 2017, pp. 1-2, doi: 10.23919/RADIO.2017.8242244.

E. J. Wyers, W. Qi and P. D. Franzon, "A robust calibration and supervised machine learning reliability framework for digitally-assisted self-healing RFICs," 2017 IEEE 60th International Midwest Symposium on Circuits and Systems (MWSCAS), 2017, pp. 1138-1141, doi: 10.1109/MWSCAS.2017.8053129.

H. Yu, M. Swaminathan, C. Ji and D. White, "A Nonlinear Behavioral Modeling Approach for Voltage-controlled Oscillators Using Augmented Neural Networks," 2018 IEEE/MTT-S International Microwave Symposium - IMS, 2018, pp. 551-554, doi: 10.1109/MWSYM.2018.8439324

Y. Xiu, S. Sagan, A. Battini, X. Ma, M. Raginsky and E. Rosenbaum, "Stochastic modeling of air electrostatic discharge parameters," 2018 IEEE International Reliability Physics Symposium (IRPS), 2018, pp. 2C.2-1-2C.2-10, doi: 10.1109/IRPS.2018.8353548.

X. Ma, M. Raginsky and A. C. Cangellaris, "A machine learning methodology for inferring network S-parameters in the presence of variability," 2018 IEEE 22nd Workshop on Signal and Power Integrity (SPI), 2018, pp. 1-4, doi: 10.1109/SaPIW.2018.8401643.

Y. Wang and P. D. Franzon, "RFIC IP Redesign and Reuse Through Surrogate Based Machine Learning Method," 2018 IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO), 2018, pp. 1-4, doi: 10.1109/NEMO.2018.8503446.

H. M. Torun, M. Swaminathan, A. Kavungal Davis and M. L. F. Bellaredj, "A Global Bayesian Optimization Algorithm and Its Application to Integrated System Design," in IEEE Transactions on Very Large Scale Integration (VLSI) Systems, vol. 26, no. 4, pp. 792-802, April 2018, doi: 10.1109/TVLSI.2017.2784783.

H. Torun & M. Swaminathan. Artificial Intelligence and Its Impact on System Design, IEEE Electronic Components and Technology Conference (ECTC), San Diego, CA, May 29 – June 1, 2018.

T. Nguyen and J. E. Schutt-Aine, "A pseudo-supervised machine learning approach to broadband LTI macro-modeling," 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), 2018, pp. 1018-1021, doi: 10.1109/ISEMC.2018.8393939.

J. Xiong, Z. Chen, Y. Xiu, Z. Mu, M. Raginsky and E. Rosenbaum, "Enhanced IC Modeling Methodology for System-level ESD Simulation," 2018 40th Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD), 2018, pp. 1-10, doi: 10.23919/EOS/ESD.2018.8509751.

Y. Wang and P. D. Franzon, "RFIC IP Redesign and Reuse Through Surrogate Based Machine Learning Method," 2018 IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO), 2018, pp. 1-4, doi: 10.1109/NEMO.2018.8503446.

H. M. Torun, J. A. Hejase, J. Tang, W. D. Beckert and M. Swaminathan, "Bayesian Active Learning for Uncertainty Quantification of High Speed Channel Signaling," 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 2018, pp. 311-313, doi: 10.1109/EPEPS.2018.8534251. INDUSTRY CO-AUTHOR

H. Yu, H. Chalamalasetty and M. Swaminathan, "Behavioral Modeling of Steady-State Oscillators with Buffers Using Neural Networks," 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 2018, pp. 307-309, doi: 10.1109/EPEPS.2018.8534238.

M. A. Dolatsara, H. Yu, J. A. Hejase, W. D. Becker and M. Swaminathan, "Polynomial Chaos modeling for jitter estimation in high-speed links," 2018 IEEE International Test Conference (ITC), 2018, pp. 1-10, doi: 10.1109/TEST.2018.8624875. INDUSTRY CO-AUTHOR

B. Li, P. Franzen, Y. Choi and C. Cheng, "Receiver Behavior Modeling Based on System Identification," 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 2018, pp. 299-301, doi: 10.1109/EPEPS.2018.8534310. INDUSTRY CO-AUTHOR

H. M. Torun and M. Swaminathan, “A New Machine Learning Approach for Optimization and Tuning of Integrated Systems”, DesignCon, Santa Clara, CA, 2018.

H. M. Torun and M. Swaminathan, "Bayesian Framework for Optimization of Electromagnetics Problems," 2018 International Workshop on Computing, Electromagnetics, and Machine Intelligence (CEMi), 2018, pp. 1-2, doi: 10.1109/CEMI.2018.8610600.

D. Das, S. Maity, S. B. Nasir, S. Ghosh, A. Raychowdhury and S. Sen, "ASNI: Attenuated Signature Noise Injection for Low-Overhead Power Side-Channel Attack Immunity," in IEEE Transactions on Circuits and Systems I: Regular Papers, vol. 65, no. 10, pp. 3300-3311, Oct. 2018, doi: 10.1109/TCSI.2018.2819499

K. Roy, H. T. Mert and M. Swaminathan, "Preliminary Application of Deep Learning to Design Space Exploration," 2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2018, pp. 1-3, doi: 10.1109/EDAPS.2018.8680888.

M. Ahadi, A. Varma, K. Keshavan, M. Swaminathan “Design Space Exploration with Polynomial Chaos Surrogate Models for Analyzing Large System Designs,” DesignCon, Jan. 2019.

E. Rosenbaum, Z. Chen, J. Xiong, “Component Modeling for System-level ESD Simulation,” InCompliance, vol. 11, no. 4, April 2019, pp. 16-19

A. Yang, A. Ghassami, E. Rosenbaum, and N. Kiyavash, “Data-Driven Reliability for Datacenter Hard Disk Drives,” Electronic Device Failure Analysis Magazine, vol. 21, no. 2, May 2019, pp. 16-21.

B. Tzen and M.Raginsky, “Theoretical Guarantees for Sampling and Inference in Generative Models with Latent Diffusions”, COLT 2019, doi 10.48550/arXiv.1903.01608.

M. Ahadi Dolatsara, J. A. Hejase, W. D. Becker and M. Swaminathan, "A Hybrid Methodology for Jitter and Eye Estimation in High-Speed Serial Channels Using Polynomial Chaos Surrogate Models," IEEE Access, vol. 7, pp. 53629-53640, 2019, doi: 10.1109/ACCESS.2019.2908799. INDUSTRY CO-AUTHOR

B. Huggins, W. R. Davis and P. Franzon, "Estimating Pareto Optimum Fronts to Determine Knob Settings in Electronic Design Automation Tools," 20th International Symposium on Quality Electronic Design (ISQED), 2019, pp. 304-310, doi: 10.1109/ISQED.2019.8697576.

M. Ahadi, J. Hejase, W. Becker, M. Swaminathan “Eye Diagram and Jitter Estimation in SerDes Designs using Surrogate Models Generated with Polynomial Chaos Theory,” DesignCon, Jan. 2019. INDUSTRY CO-AUTHOR

H. Yu, J. Shin, T. Michalka, M. Larbi and M. Swaminathan, "Behavioral Modeling of Tunable I/O Drivers with Pre-emphasis Using Neural Networks," 20th International Symposium on Quality Electronic Design (ISQED), 2019, pp. 247-252, doi: 10.1109/ISQED.2019.8697597. INDUSTRY CO-AUTHOR

M. A. Dolatsara, A. Varma, K. Keshavan and M. Swaminathan, "A Modified Polynomial Chaos Modeling Approach for Uncertainty Quantification," 2019 International Applied Computational Electromagnetics Society Symposium (ACES), 2019, pp. 1-2.

M. Larbi, H. M. Torun and M. Swaminathan, "Estimation of Parameter Variability for High Dimensional Microwave Problems via Partial Least Squares," 2019 IEEE MTT-S International Microwave Symposium (IMS), 2019, pp. 940-943, doi: 10.1109/MWSYM.2019.8700749.

D. Das, A. Golder, J. Danial, S. Ghosh, A. Raychowdhury and S. Sen, "X-DeepSCA: Cross-Device Deep Learning Side Channel Attack," 2019 56th ACM/IEEE Design Automation Conference (DAC), 2019, pp. 1-6.

A. Golder, D. Das, J. Danial, S. Ghosh, S. Sen and A. Raychowdhury, Practical Approaches Toward Deep-Learning-Based Cross-Device Power Side-Channel Attack,” IEEE Transactions on Very Large Scale Integration (VLSI) Systems, July 2019, doi 10.1109/TVLSI2019.2926324.

A. Agnesina, E. Lepercq, J. Escobedo and S. K. Lim, "Reducing Compilation Effort in Commercial FPGA Emulation Systems Using Machine Learning," 2019 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 2019, pp. 1-8, doi: 10.1109/ICCAD45719.2019.8942091.

H. Liu, Y. Zhou, A. Beirami, and D. Baron, “Nonlinear function estimation with empirical Bayes and approximate message passing,” 57th Allerton Conf. Communication, Control, & Computing, Sep. 2019, doi 10.48550/arXiv/1907.02482.

Y. -C. Lu, J. Lee, A. Agnesina, K. Samadi and S. K. Lim, "GAN-CTS: A Generative Adversarial Framework for Clock Tree Prediction and Optimization," 2019 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 2019, pp. 1-8, doi: 10.1109/ICCAD45719.2019.8942063.

H. M. Torun, A. C. Durgun, K. Aygün and M. Swaminathan, "Enforcing Causality and Passivity of Neural Network Models of Broadband S-Parameters," 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 2019, pp. 1-3, doi: 10.1109/EPEPS47316.2019.193234.

H. Ma, E. -P. Li, A. C. Cangellaris and X. Chen, "Comparison of Machine Learning Techniques for Predictive Modeling of High-Speed Links," 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 2019, pp. 1-3, doi: 10.1109/EPEPS47316.2019.193199.

H. M. Torun et al., "A Spectral Convolutional Net for Co-Optimization of Integrated Voltage Regulators and Embedded Inductors," 2019 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 2019, pp. 1-8, doi: 10.1109/ICCAD45719.2019.8942109.

O. W. Bhatti and M. Swaminathan, "Impedance Response Extrapolation of Power Delivery Networks using Recurrent Neural Networks," 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 2019, pp. 1-3, doi: 10.1109/EPEPS47316.2019.193198.

J. Hanson and M. Raginsky, “Universal approximation of input-output maps by temporal convolutional nets”, Neural Information Processing Systems (NeurIPS), Vancouver, Canada, December 8-14, 2019, p 14071-14081, doi 10.48550/14Xiv.1906.09211.

A. Balakir, A. Yang and E. Rosenbaum, "An Interpretable Predictive Model for Early Detection of Hardware Failure," 2020 IEEE International Reliability Physics Symposium (IRPS), 2020, pp. 1-5, doi: 10.1109/IRPS45951.2020.9129615.

H. Ma, E. -P. Li, A. C. Cangellaris and X. Chen, "Support Vector Regression-Based Active Subspace (SVR-AS) Modeling of High-Speed Links for Fast and Accurate Sensitivity Analysis," in IEEE Access, vol. 8, pp. 74339-74348, 2020, doi: 10.1109/ACCESS.2020.2988088.

J. Hanson and M. Raginsky, “Universal simulation of stable dynamical systems by recurrent neural nets”, Proceedings of the 2nd Conference on Learning for Dynamics and Control (L4DC), PMLR 120:384-392, June, 2020.

Y. -C. Lu, S. S. Kiran Pentapati, L. Zhu, K. Samadi and S. K. Lim, "TP-GNN: A Graph Neural Network Framework for Tier Partitioning in Monolithic 3D ICs," 2020 57th ACM/IEEE Design Automation Conference (DAC), 2020, pp. 1-6, doi: 10.1109/DAC18072.2020.9218582.

H. Ma, E-P. Li, A.C. Cangellaris, X. Chen, “Expedient Prediction of Eye Opening of High-Speed Links with Input Design Space Dimensionality Reduction,” Proc 2020 IEEE International Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMCSI), Reno, NV, July 2020, doi: 10.1109/EMCSI38923.2020.9191544

A. Yang, A-E.Ghassami, M. Raginsky, N. Kiyavash, and E. Rosenbaum, “Model-Augmented Conditional Mutual Information Estimation for Feature Selection”, Proceedings of Machine Learning Research, August 3-6, 2020.

M. Swaminathan, H. M. Torun, H. Yu, J. A. Hejase and W. D. Becker, "Demystifying Machine Learning for Signal and Power Integrity Problems in Packaging," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 10, no. 8, pp. 1276-1295, Aug. 2020, doi: 10.1109/TCPMT.2020.3011910.

H. M. Torun, A. C. Durgun, K. Aygün and M. Swaminathan, "Causal and Passive Parameterization of S-Parameters Using Neural Networks," IEEE Transactions on Microwave Theory and Techniques, vol. 68, no. 10, pp. 4290-4304, Oct. 2020, doi: 10.1109/TMTT.2020.3011449.

F. Aydin, P. Kashyap, S Potluri, P. Franzon, A. Aysu, “DeePar-SCA: Breaking Parallel Architectures of Lattice Cryptography via Learning Based Side-Channel Attacks”, International Conference on Embedded Computer Systems: Architectures, Modeling and Simulation (SAMOS), October 7, 2020.

Regazzoni et al., “Machine Learning and Hardware security: Challenges and Opportunities -Invited Talk-,” 2020 IEEE/ACM International Conference On Computer Aided Design (ICCAD), San Diego, CA, USA, 2020, pp. 1-6.

P. Kashyap, F. Aydin, S. Potluri, P. D. Franzon and A. Aysu, "2Deep: Enhancing Side-Channel Attacks on Lattice-Based Key-Exchange via 2-D Deep Learning," in IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, vol. 40, no. 6, pp. 1217-1229, June 2021, doi: 10.1109/TCAD.2020.3038701.

L. Francisco et al., "Design Rule Checking with a CNN Based Feature Extractor," 2020 ACM/IEEE 2nd Workshop on Machine Learning for CAD (MLCAD), 2020, pp. 9-14, doi: 10.1145/3380446.3430625.

I. Turtletaub, M. Ibrahim, G. Li, and P. Franzon, “Application of Quantum Machine Learning to VLSI Placement,” MLCAD ’20: Proceedings of the 2020 ACM/IEEE Workshop on Machine Learning for CAD, Virtual Event Iceland, November 2020, pp, 61-66.

Rosenbaum, J. Xiong, A. Yang, Z. Chen and M. Raginsky, “Machine Learning for Circuit Aging Simulation,” 2020 IEEE International Electron Devices Meeting (IEDM), San Francisco, CA, USA, 2020, pp. 39.1.1-39.1.4, doi: 10.1109/IEDM13553.2020.9371931.

Y-C Lu, S. Nath, S. S. Kiran Pentapati and S. K. Lim, “A Fast Learning-Driven Signoff Power Optimization Framework,” 2020 IEEE/ACM International Conference On Computer Aided Design (ICCAD), San Diego, CA, USA, 2020, pp. 1-9. INDUSTRY CO-AUTHOR

H. Huang, A. C. Cangellaris and X. Chen, “Stochastic-Galerkin Finite-Difference Time-Domain for Waves in Random Layered Media,” 2020 IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO), Hangzhou, China, 2020, pp. 1-4, doi: 10.1109/NEMO49486.2020.9343635.

Y-C Lu, S. Pentapati, and S. K. Lim. 2021, “The Law of Attraction: Affinity-Aware Placement Optimization using Graph Neural Networks”, Proceedings of the 2021 International Symposium on Physical Design (ISPD ‘21), Association for Computing Machinery, New York, NY, USA, 7–14. DOI:https://doi.org/10.1145/3439706.3447045

L. Francisco, P. Franzon and W. R. Davis, “Fast and Accurate PPA Modeling with Transfer Learning,” 2021 ACM/IEEE 3rd Workshop on Machine Learning for CAD (MLCAD), Aug 30 – Sept 3, 2021, pp. 1-6, doi: 10.1109/MLCAD52597.2021.9531109.

J. Xiong, Z. Chen, M. Raginsky and E. Rosenbaum, “Statistical Learning of IC Models for System-Level ESD Simulation,”IEEE Transactions on Electromagnetic Compatibility, vol. 63, no. 5, pp. 1302-1311, Oct. 2021, doi: 10.1109/TEMC.2021.3076492.

O.W. Bhatti, H. M. Torun and M. Swaminathan, “HilbertNet: A Probabilistic Machine Learning Framework for Frequency Response Extrapolation of Electromagnetic Structures,” in IEEE Transactions on Electromagnetic Compatibility, Nov 24, 2021, p 1-13. doi: 10.1109/TEMC.2021.3119277.

G. Aydin & E. Karabulut, & S. Potluri, & E. Alkim & A. Aysu, “RevEAL: Single-Trace Side-Channel Leakage of the SEAL Homomorphic Encryption Library”, 2022 Design, Automation and Test in Europe (DATE), December 2021.

Y-C. Lu, S. Nath, V. Khandelwal, and S.K. Lim, “RL-Sizer: VLSI Gate Sizing for Timing Optimization using Deep Reinforcement Learning”, 58th ACM/IEEE Design Automation Conference (DAC), Dec 5-9, 2021. 10.1109/DAC18074.2021.9586138 INDUSTRY CO-AUTHOR

O.W. Bhatti, N. Ambasana and M. Swaminathan, “Inverse Design of Power Delivery Networks using Invertible Neural Networks,” 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 2021, pp. 1-3, doi: 10.1109/EPEPS51341.2021.9609211.

N. Ambasana et al., “Invertible Neural Networks for High-Speed Channel Design & Parameter Distribution Estimation,” 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 2021, pp. 1-3, doi: 10.1109/EPEPS51341.2021.9609225.

X-J. Shangguan, H. Ma, A. C. Cangellaris and X. Chen, “Effect of Sampling Method on the Regression Accuracy for a High-Speed Link Problem,” 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 2021, pp. 1-3, doi: 10.1109/EPEPS51341.2021.9609130.

O. W. Bhatti et al., “Comparison of Invertible Architectures for High Speed Channel Design,” 2021 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 2021, pp. 1-3, doi: 10.1109/EDAPS53774.2021.9657014. BEST STUDENT PAPER AWARD

P. Kashyap, W. S. Pitts, D. Baron, C. -W. Wong, T. Wu and P. D. Franzon, "High Speed Receiver Modeling Using Generative Adversarial Networks," 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 2021, pp. 1-3, doi: 10.1109/EPEPS51341.2021.9609124.

J. Xiong, A. S. Yang, M. Raginsky and E. Rosenbaum, "Neural Networks for Transient Modeling of Circuits : Invited Paper," 2021 ACM/IEEE 3rd Workshop on Machine Learning for CAD (MLCAD), 2021, pp. 1-7, doi: 10.1109/MLCAD52597.2021.9531153.

O.W. Bhatti and M. Swaminathan, “Design Space Extrapolation for Power Delivery Networks using a Transposed Convolutional Net”, 22nd International Symposium on Quality Electronic Design (ISQED’21) 2021, pp. 7-12, doi: 10.1109/ISQED51717.2021.9424309.

P. Kashyap et al., "Modeling of Adaptive Receiver Performance Using Generative Adversarial Networks," 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2022, pp. 1958-1963, doi: 10.1109/ECTC51906.2022.00307.

A. Yang, J. Xiong, M. Raginsky, & E. Rosenbaum, "Input-to-State Stable Neural Ordinary Differential Equations with Applications to Transient Modeling of Circuits," 4th Annual Conference on Learning for Dynamics and Control, Proceedings of Machine Learning Research, 2022, vol 168, p1-13, doi: 10.48550/arXiv.2202.06453

M. Swaminathan, O. W. Bhatti, Y. Guo, E. Huang and O. Akinwande, "Bayesian Learning for Uncertainty Quantification, Optimization, and Inverse Design," in IEEE Transactions on Microwave Theory and Techniques, 2022, doi: 10.1109/TMTT.2022.3206455.

A. Page and X. Chen, "Efficient Uncertainty Quantification of Stripline Pulse Response using Singular Value Decomposition and Delay Extraction," 2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), 2022, pp. 4-6, doi: 10.1109/APEMC53576.2022.9888395.

H. Ma et al., "Channel Inverse Design Using Tandem Neural Network," 2022 IEEE 26th Workshop on Signal and Power Integrity (SPI), 2022, pp. 1-3, doi: 10.1109/SPI54345.2022.9874935.

J. Xiong, A. Yang, M. Raginsky and E. Rosenbaum, "Neural Ordinary Differential Equation Models of Circuits: Capabilities and Pitfalls," in IEEE Transactions on Microwave Theory and Techniques, 2022, doi: 10.1109/TMTT.2022.3208896.

A.Gajjar, P. Kashyap, A. Aysu, P. Franzon, S. Dey and C. Cheng, "FAXID: FPGA-Accelerated XGBoost Inference for Data Centers using HLS," 2022 IEEE 30th Annual International Symposium on Field-Programmable Custom Computing Machines (FCCM), 2022, pp. 1-9, doi: 10.1109/FCCM53951.2022.9786085 INDUSTRY CO-AUTHOR